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1‑VIA Expands Globally with New India R&D Office in Pune to Accelerate Innovation in Data Center Connectivity

Reading, UK / Pune, India - July 23, 2025

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1‑VIA, a global semiconductor company designing high-performance PAM4 retimers and Linear Pluggable Optics (LPO) solutions for modern data centers, today announced the opening of a new R&D office in Pune, India. The expansion marks a major step in the company’s global growth strategy and reinforces its commitment to deep, sustained investment in engineering innovation.

1-VIA team in Pune

With headquarters in Reading, UK, 1‑VIA is building a globally distributed team where engineering groups in the UK and Pune will collaborate closely on the company’s most advanced silicon products—including its industry-leading PAM-X DSP architecture, LPO solutions and mixed-signal IP blocks.

​

As part of its global growth strategy, 1‑VIA is doubling down on R&D investment to accelerate development of next-generation PAM4 retimers, LPO solutions and mixed-signal IP. The Pune office is a key pillar in this expanded innovation ecosystem, complementing the UK headquarters’ engineering expertise.

​

“India is home to some of the best semiconductor talent in the world,” said Suhas Rattan, CEO and Co-Founder of 1‑VIA. “Our innovation-first model drives everything we do. By doubling down on R&D and expanding into Pune, we’re investing in exceptional talent and growing our global engineering capabilities. Our teams in Pune and the UK will work hand-in-hand to deliver industry-defining connectivity solutions.”

​

Building the Future of Interconnects

 

1‑VIA’s UK and Pune teams will collaborate on cutting-edge semiconductor development in areas including:

  • PAM4 retimer and equalization silicon

  • Linear Pluggable Optics (LPO) chipset development

  • Laser drivers, transimpedance amplifiers and SerDes IP for hyperscale data center links

  • End-to-end mixed-signal design and modelling for high-throughput low-power systems

​

The company’s solutions are enabling a new generation of high-bandwidth energy-efficient connectivity for AI infrastructure, cloud platforms and next-gen Ethernet networks.

 

Global Team, Global Hiring

 

1‑VIA is actively hiring across both its UK and Pune offices with open roles in:

  • Analog & RF IC Design

  • DSP & Mixed-Signal Architecture

  • RTL & Physical Design

  • Layout, Verification and System Modelling

​

“We operate as one global engineering team,” added Ivaylo Avramov, Co-Founder and COO. “By connecting our UK and Pune offices through shared ownership and culture, we’re creating an environment where innovation flows across borders and across disciplines.”

​

About 1‑VIA

 

1‑VIA is a global semiconductor company delivering high-performance ultra-efficient connectivity silicon for data centers and cloud infrastructure. Its IP portfolio includes PAM4 retimers, LPO solutions, laser drivers, transimpedance amplifiers and advanced mixed-signal components designed for maximum performance at minimum power. Headquartered in Reading, UK with engineering teams in Pune, India, 1‑VIA is committed to building a world-class collaborative R&D culture.

​

Website: www.1-via.com
Careers: www.1-via.com/careers

​

Media Contact:

Xidi Cheng
enquiries@1-via.com
+44 (0)11-89000532

1‑VIA Expands Globally with New India R&D Office in Pune to Accelerate Innovation in Data Center Connectivity

Reading, UK / Pune, India - July 23, 2025

​

1‑VIA, a global semiconductor company designing high-performance PAM4 retimers and Linear Pluggable Optics (LPO) solutions for modern data centers, today announced the opening of a new R&D office in Pune, India. The expansion marks a major step in the company’s global growth strategy and reinforces its commitment to deep, sustained investment in engineering innovation.

1-VIA team in Pune

With headquarters in Reading, UK, 1‑VIA is building a globally distributed team where engineering groups in the UK and Pune will collaborate closely on the company’s most advanced silicon products—including its industry-leading PAM-X DSP architecture, LPO solutions and mixed-signal IP blocks.

​

As part of its global growth strategy, 1‑VIA is doubling down on R&D investment to accelerate development of next-generation PAM4 retimers, LPO solutions and mixed-signal IP. The Pune office is a key pillar in this expanded innovation ecosystem, complementing the UK headquarters’ engineering expertise.

​

“India is home to some of the best semiconductor talent in the world,” said Suhas Rattan, CEO and Co-Founder of 1‑VIA. “Our innovation-first model drives everything we do. By doubling down on R&D and expanding into Pune, we’re investing in exceptional talent and growing our global engineering capabilities. Our teams in Pune and the UK will work hand-in-hand to deliver industry-defining connectivity solutions.”

​

Building the Future of Interconnects

 

1‑VIA’s UK and Pune teams will collaborate on cutting-edge semiconductor development in areas including:

  • PAM4 retimer and equalization silicon

  • Linear Pluggable Optics (LPO) chipset development

  • Laser drivers, transimpedance amplifiers and SerDes IP for hyperscale data center links

  • End-to-end mixed-signal design and modelling for high-throughput low-power systems

​

The company’s solutions are enabling a new generation of high-bandwidth energy-efficient connectivity for AI infrastructure, cloud platforms and next-gen Ethernet networks.

 

Global Team, Global Hiring

 

1‑VIA is actively hiring across both its UK and Pune offices with open roles in:

  • Analog & RF IC Design

  • DSP & Mixed-Signal Architecture

  • RTL & Physical Design

  • Layout, Verification and System Modelling

​

“We operate as one global engineering team,” added Ivaylo Avramov, Co-Founder and COO. “By connecting our UK and Pune offices through shared ownership and culture, we’re creating an environment where innovation flows across borders and across disciplines.”

​

About 1‑VIA

 

1‑VIA is a global semiconductor company delivering high-performance ultra-efficient connectivity silicon for data centers and cloud infrastructure. Its IP portfolio includes PAM4 retimers, LPO solutions, laser drivers, transimpedance amplifiers and advanced mixed-signal components designed for maximum performance at minimum power. Headquartered in Reading, UK with engineering teams in Pune, India, 1‑VIA is committed to building a world-class collaborative R&D culture.

​

Website: www.1-via.com
Careers: www.1-via.com/careers

​

Media Contact:

Xidi Cheng
enquiries@1-via.com
+44 (0)11-89000532

1‑VIA Expands Globally with New India R&D Office in Pune to Accelerate Innovation in Data Center Connectivity

Reading, UK / Pune, India - July 23, 2025

​

1‑VIA, a global semiconductor company designing high-performance PAM4 retimers and Linear Pluggable Optics (LPO) solutions for modern data centers, today announced the opening of a new R&D office in Pune, India. The expansion marks a major step in the company’s global growth strategy and reinforces its commitment to deep, sustained investment in engineering innovation.

With headquarters in Reading, UK, 1‑VIA is building a globally distributed team where engineering groups in the UK and Pune will collaborate closely on the company’s most advanced silicon products—including its industry-leading PAM-X DSP architecture, LPO solutions and mixed-signal IP blocks.

​

As part of its global growth strategy, 1‑VIA is doubling down on R&D investment to accelerate development of next-generation PAM4 retimers, LPO solutions and mixed-signal IP. The Pune office is a key pillar in this expanded innovation ecosystem, complementing the UK headquarters’ engineering expertise.

​

“India is home to some of the best semiconductor talent in the world,” said Suhas Rattan, CEO and Co-Founder of 1‑VIA. “Our innovation-first model drives everything we do. By doubling down on R&D and expanding into Pune, we’re investing in exceptional talent and growing our global engineering capabilities. Our teams in Pune and the UK will work hand-in-hand to deliver industry-defining connectivity solutions.”

​

Building the Future of Interconnects

 

1‑VIA’s UK and Pune teams will collaborate on cutting-edge semiconductor development in areas including:

  • PAM4 retimer and equalization silicon

  • Linear Pluggable Optics (LPO) chipset development

  • Laser drivers, transimpedance amplifiers and SerDes IP for hyperscale data center links

  • End-to-end mixed-signal design and modelling for high-throughput low-power systems

​

The company’s solutions are enabling a new generation of high-bandwidth energy-efficient connectivity for AI infrastructure, cloud platforms and next-gen Ethernet networks.

 

Global Team, Global Hiring

 

1‑VIA is actively hiring across both its UK and Pune offices with open roles in:

  • Analog & RF IC Design

  • DSP & Mixed-Signal Architecture

  • RTL & Physical Design

  • Layout, Verification and System Modelling

​

“We operate as one global engineering team,” added Ivaylo Avramov, Co-Founder and COO. “By connecting our UK and Pune offices through shared ownership and culture, we’re creating an environment where innovation flows across borders and across disciplines.”

​

About 1‑VIA

 

1‑VIA is a global semiconductor company delivering high-performance ultra-efficient connectivity silicon for data centers and cloud infrastructure. Its IP portfolio includes PAM4 retimers, LPO solutions, laser drivers, transimpedance amplifiers and advanced mixed-signal components designed for maximum performance at minimum power. Headquartered in Reading, UK with engineering teams in Pune, India, 1‑VIA is committed to building a world-class collaborative R&D culture.

​

Website: www.1-via.com
Careers: www.1-via.com/careers

​

Media Contact:

Xidi Cheng
enquiries@1-via.com
+44 (0)11-89000532

1-VIA team in Pune
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